Capabilities
| TECHNOLOGY | TYPICAL | COMPLEX |
| Max. Panel Size | 18" X 24" | 21" X 24" |
| Max. Board Size | 16.5" X 22.5" | 19.5" X 22.5" |
| Max. Layers | 8 | 12 |
| Max. Board Thickness | .125" | .200"-.250" |
| Min. Core Thickness | .010" | n/a |
| Max. Copper Weight | 6 OZ. | 8 OZ. |
| Min. Line Width/Spacing | .008"/.008" | .005"/.005" |
| Smallest Drilled Holes | .018" | .010"-.015" |
| Hole Aspect Ratio | 6:1 | 8:1/10:1 |
| Materials | FR4 Tetrafunctional (140Tg)-Multifunctional (170 Tg)-Lead Free (180 Tg)-Ventec High Performance-FR408-Polyimide | |
| Finishes RoHS & Non-RoHS | ENIG Electroless Nickel/Immersion Gold-Immersion Silver-Electrolytic Nickel/Gold-Horizontal Lead-free HASL-Tin-lead HAL |
BOARD TYPES:
Commercial/MIL to IPC Standards, UL Approved
LAYER COUNTS:
Unclad
Single Sided
Double Sided
Multilayer: 4 to 6 Layers and up
SOLDER MASK:
1) Liquid Photoimagable - SMOBC
2) Thermal Cure (Ex SR 1000, SR1010)
2) Per Customer Specification
Color (Blue, Black, Red, Green)
ELECTRICAL TEST:
Full Continuity Testing as Required by Customer, Net List if Required
CAM/PHOTOPLOTTING:
Full Capability Available in house
MATERIALS:
FR4, Polyimide, G-l1, G-10, FR5, CEM (any colors)
SCORING OR WEB ROUTING:
Available in house
Reverse Engineering:
Digital Optimization (Bomb Siting in House)
LEAD TIMES:
Double sided — 2 to 3 week (standard)
Multilayer — 2 to 3 week (standard)
QUICK-TURN
CAPABILITY